ESA Intended Invitation To Tender


Program ref.: GSTP Element 1 Dev
Tender Type: C
Tender Status: INTENDED
Price Range: > 500 KEURO
Budget Ref.: E/0904-611 - GSTP Element 1 Dev
Proc. Prop.: DIPC
Special Prov.: DE
Establishment: ESTEC
Directorate: Directorate of Tech, Eng. & Quality
Department: Electrical Engineering Department
Division: Data Systems Division
Responsible: Magistrati, Giorgio
Products: Satellites & Probes / Electronics / EEE Components / Monolithic Microcircuits (including MMICs)
Techology Domains: Onboard Data Systems / Onboard Data Management / System
System Design & Verification / Mission and System Specification / Specification Methods and Tools
Industrial Policy Measure: N/A - Not apply
Publication Date: 08-OCT-18

Based on a preliminary COTS Component list, it is proposed in the frame of this activity to critically survey and select potential component candidates inline with system requirements (e.g. fault tolerant OBC/Data handling systems). Besides specific requirements for challenging ESA missions, requirements for applications such as Cubesats, Microsats and Minisats shall be considered. In particular, novel EEE Components offered as radiation tolerant by various manufacturers shall also be considered in the survey. The components then selected shall be testable (i.e. possible to de-lid for SEE testing) and, once completed the testing, the chosen componentsshall be purchased in lots to identify lot-uniformity, including component traceability information as far as possible (e.g. lot number, date code, etc.). Following the component selection process, an irradiation pre-screening (TID and Single Event Latch-Up) toremove weak components shall be performed. The remaining successful candidates shall undergo a comprehensive and relevant irradiation test campaign (TID, DD and SEE) and also a full functional and electrical characterisation for performance verification vis-a-visESA requirements. In addition, for all tests, there will be Test Plans generated and, following completion of tests, the elaboration of dedicated test reports. Finally, experiences gained during testing of candidate components shall be submitted to the ComponentTechnology Board Radiation working Group in the form of guidelines for possible inclusion in European Radiation Hardness Assurancestandards. When found necessary and within the financial envelope of the activity, additional tests such as outgassing, thermal tests, etc. shall be carried out. NOTE: This activity is currently in the GSTP Work Plan but will only be implemented after confirmationof financial support from Delegations. The final list of participating states will be known at tender issue.